Ventilated facade substructure system, specially recommended for low-thickness extrusioned ceramic envelopes. Concealed-connections system.
- It consist on “L” shaped aluminium brackets, T-kind grooved vertical profiles, stainless steel clips and EPDM rubber profiles. Both EPDM and clips are installed through the profile channel to grab the tile, ensure a perfect orientation and prevent any vibration.
- Connection elements stainless steel self-drilling screws and wall mounting anchors.
- Standard gap: 105 mm – 225 mm ( wider or thinner available upon request).
- Envelope thickness: adequate for thickness between 14 and 20 mm.
Note: anodizing an coating profiles upon request. Colour upon request too. T profiles and bracket available on different sizes and thickness.